Wafer‑map yield analysis
Drop the STDF from your prober. Notchmark maps every wafer, labels edge rings, scratches, clusters and center failures, and tells you why. It runs in your browser, so no die data is ever uploaded.
Demo
Who it's for
Low volumes, high die cost, and edge and substrate defects that matter on every wafer.
Many customers and processes, few yield engineers, and data that cannot go to the cloud.
Hand every customer a lot report with maps and patterns, not a CSV dump.
Shuttle and engineering lots where you need answers fast and have no yield platform.
How it works
Wafer IDs, hard bins, bin names and pass/fail come straight from the STDF records. Gzipped files and multi‑site probing work too.
Edge ring, center, scratch, cluster, edge‑local and random. Every label shows the numbers behind it and where to look in the process.
Fail‑bin Pareto with cumulative share, and a stacked map of which die positions fail across every wafer. Copy the summary into a report or MES ticket.
Data security
Wafer maps reveal yields, process problems and customer volumes. Notchmark is built so there is nothing to leak.
| Spreadsheets & scripts | Enterprise yield platforms | Notchmark | |
|---|---|---|---|
| Time to first map | Hours per lot | Weeks to months of setup | Under a minute |
| Where data goes | Local | A server you or the vendor run | Stays in your browser |
| Pattern labels | By eye | Yes | Yes, with reasons |
| Who can use it | Whoever wrote the macro | Licensed seats | Any engineer with a browser |
Free pilot · first 10 teams
FAQ
STDF V4 from wafer sort (.stdf, .std or gzipped), and CSV with one row per die (wafer, x, y, bin). Tell us your tester and prober and we will confirm with a sample file before the pilot.
With transparent rules: fail rate by radius, failing edge sectors, and connected clusters of failing dies with their shape. Every label shows the numbers behind it, so you can judge it yourself.
No. Files are read by your browser and processed in memory. Closing the tab discards them.
Yes. Results are grouped by wafer per test head, and the last result for each die position is used, so retests replace the first pass.
A per‑engineer subscription priced for small teams, with a site licence for the offline version. Pilot teams lock in founding pricing.